Reflow oven wave soldering machine pick and place machine SMT assembly line

Introduction of Yamaha M10 Hybrid Modular Surface Mounter for SMT Assembly line Handling large board as standard · Revolutionary and unique new features included as standard · New Multi-Conveyor System providing the highest large board handling capability · 3D hybrid placement functions · Wide ranging component handling capability and high feeder capacity · Ultimate flexibility and fast & easy setup Specifications M10 Board size(with buffer unused) Min. L50 x W30mm to Max. L980 x W510mm *1 Board size(with input or output buffer used) Min. L50 x W30mm to Max. L420 x W510mm Board size(with input and output buffers used) Min. L50 x W30mm to Max. L330 x W510mm Board thickness 0.4 - 4.8mm Board flow direction Left to right (Std) Board transfer speed Max 900mm/sec Placement speed (4 heads + 1 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH) Placement speed (4 heads + 4 theta) Opt. Cond. 0.15sec/C...

Introduction of  Yamaha S20 3D Hybrid Modular Surface Mounter for SMT Assembly line Ultimate Flexibility to realize 3D MID* Placement · Enhancement to 3D MID · Large board handling capability · Wide ranging component handling capability and high feeder capacity · Ultimate flexibility and fast & easy setup 3D MID: Molded Interconnect Device Specifications S20 Board size(with buffer unused) Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) Board size(with input and output buffers used) Min. L50 x W30mm to Max. L540 x W510mm Board thickness 0.4 - 4.8mm Board flow direction Left to right (Std) Board transfer speed Max 900mm/sec Placement speed (12 heads + 2 theta) Opt. Cond. 0.08sec/CHIP (45,000CPH) Placement accuracy A (μ+3σ) CHIP +/-0.040mm Placement accuracy B (μ+3σ) IC +/-0.025mm Placement angle +/-180 degrees Z axis control / Theta axis control AC servo motor Co...