Reflow oven wave soldering machine pick and place machine SMT assembly line

Introduce of SMT Pick and Place Machine: The Fuji NXT designed to meet the demands of modern production environments. Its interchangeable placement heads allow each machine module to function as either a high speed  chip mounter  or a multifunction placement machine and – enabling the changeover of a complete production line in just minutes. NXT modules are rapidly reconfigurable to ensure your ability to real-time production demands. M3II , M6II and newly launched M6II SP (High Accuracy Module) modules can be arranged and quickly rearranged to specifically fit your unique and dynamically changing production environment. Horizontal loading intelligent feeders not only allow components to be loaded while the machine is moving they eliminate setup errors, as the ID function ensures that components are delivered where they are needed on the board. NXT-II Fuji Scalable Placement Platform, Fuji NXT-II Fuji Scalable Placement Platform, FUJI Machine Mfg, FUJI Machine Partner, India Exchang

Introduce of SMT Pick and Place Machine: A high-speed modular mounter with production capacity increased by 20%,※1 improved economical efficiency, operations, and reliability.      ■ 40,000CPH (Optimum) (0.09 sec/chip)※2 30,000CPH (IPC9850)※2  ■  Two multi laser heads (12 nozzles)  ■  Component size: from 0402 (01005) to 33.5mm square     ※1 Compared with previous model  ※2 Actual throughput may vary. Main Features of SMT Pick and Place Machine： Board size L size (410×360mm) Component height 6mm Component size 0402 (01005)~□33.5mm Placement speed (chip) Chip Optimum 0.09Sec./chip (40,000CPH) IPC9850 30,000CPH Placement accuracy (Laser recognition) ±0.05mm （ ±3σ ） Feeder inputs Max. 80 on 8mm T/F Keywords: Modular Surface Mounter , cheap price  pick and place machine ,  IC placer,  modular surface mounter second hand price ,   chip mounter Flason Electronic Co.,ltd provide a full  smt assembly line  solutions, includin

Introduction of  Yamaha M20 Hybrid Modular Surface Mounter for PCB assembly line Handling max. 1,480mm ultra long board as standard · Revolutionary and unique new features included as standard · New Multi-Conveyor System providing the highest large board handling capability · 3D hybrid placement functions · Wide ranging component handling capability and high feeder capacity · Ultimate flexibility and fast & easy setup Specifications M20 Board size(with buffer unused) Min. L50 x W30mm to Max. L1,480 x W510mm*1 Board size(with input and output buffers used) Min. L50 x W30mm to Max. L540 x W510mm Board thickness 0.4 - 4.8mm Board flow direction Left to right (Std) Board transfer speed Max 900mm/sec Placement speed (4 heads + 1 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH) Placement speed (4 heads + 4 theta) Opt. Cond. 0.15sec/CHIP (24,000CPH) Placement speed (6 heads + 2 theta) Opt. Cond. 0.12sec/CHIP (30,000CPH)*2